E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
This report studies the global E-Chuck for Wafer market status and forecast, categorizes the global E-Chuck for Wafer market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in United States, Europe, China, Japan, South Korea and Taiwan and other regions.
The major manufacturers covered in this report
Creative Technology Corporation
II-VI M Cubed
Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
We can also provide the customized separate regional or country-level reports, for the following regions:
Rest of Asia-Pacific
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
Coulomb Type E-Chuck for Wafer
Johnsen-Rahbek (JR) Type E-Chuck for Wafer
On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including
300 mm Wafer
200 mm Wafer
The study objectives of this report are:
To analyze and study the global E-Chuck for Wafer capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
Focuses on the key E-Chuck for Wafer manufacturers, to study the capacity, production, value, market share and development plans in future.
Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of E-Chuck for Wafer are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
E-Chuck for Wafer Manufacturers
E-Chuck for Wafer Distributors/Traders/Wholesalers
E-Chuck for Wafer Subcomponent Manufacturers
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Regional and country-level analysis of the E-Chuck for Wafer market, by end-use.
Detailed analysis and profiles of additional market players.