Encapsulation is generally adopted in packaging of lamp-LEDs. The encapsulation procedure is to pour liquid epoxy into the LED moulding chamber first, and then insert the LED bracket that has undergone the press welding, then put the mould into the oven, and the LED gets shaped when the epoxy solidifies.
The global LED Encapsulation market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on LED Encapsulation volume and value at global level, regional level and company level. From a global perspective, this report represents overall LED Encapsulation market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
The following manufacturers are covered:
Segment by Regions
Segment by Type
Segment by Application